Computer-aided function testing.
Automated and manual handling of connectors and contacts.
Splice technology with crimp force and CrimpLab monitoring.
Coaxial assembly, ESD-secured assemblies, and automatic cutting, stripping, and crimping.
Low-pressure hotmelt/macromelt technology.
Shrink tube and inkjet printing, barcode labeling.
Electrical testing, soldering to RoHS standards.
Dielectric strength testing up to 5kVDC/AC.
PCB design and advanced bundling technologies.
These advanced resources and capabilities enable us to deliver high-quality, reliable products tailored to the specific requirements of our customers across various industries.
