Our technical capabilities cover:

  • Computer-aided function testing
  • Automatic and manual handling of connectors and contacts
  • Splice technology
  • Crimp force monitoring
  • CrimpLab monitoring
  • Coaxial assembling
  • ESD secured assemblies
  • Automatic cutting & stripping&crimping tecnology
  • Hotmelt/macromelt tehnology
  • Shrink tube printing
  • Inkjet printing
  • barcode labelling
  • Electrical testing
  • Soldering according to RoHS regulations
  • Dielectric strength test up to 5kVDC/AC
  • PCB design
  • Bundling technologies